Silicon Wafer Dicing, PCB Stencil Die Board Laser Cutting Machine for PCB Circuit Board FPC IC Chip

Product Details
Customization: Available
After-sales Service: Installation & Operation Guide
Warranty: 24months
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  • Silicon Wafer Dicing, PCB Stencil Die Board Laser Cutting Machine for PCB Circuit Board FPC IC Chip
  • Silicon Wafer Dicing, PCB Stencil Die Board Laser Cutting Machine for PCB Circuit Board FPC IC Chip
  • Silicon Wafer Dicing, PCB Stencil Die Board Laser Cutting Machine for PCB Circuit Board FPC IC Chip
  • Silicon Wafer Dicing, PCB Stencil Die Board Laser Cutting Machine for PCB Circuit Board FPC IC Chip
  • Silicon Wafer Dicing, PCB Stencil Die Board Laser Cutting Machine for PCB Circuit Board FPC IC Chip
  • Silicon Wafer Dicing, PCB Stencil Die Board Laser Cutting Machine for PCB Circuit Board FPC IC Chip
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Basic Info.

Model NO.
TXT-DB-F20/30/50/100
Laser Visibility
Invisible
Applicable Material
All
Cooling System
Water Cooling
Technical Class
Pulse Laser
Laser Wavelength
355nm 1064nm 10.6um
Laser Classification
Green/Diode Laser
Type
Customize
Control Card
Beijing Jcz
Engraving Software
Ezcad
Power
5W 10W 15W 20W
Working Temp.
0~40 Celsius Degree
Storage Temp.
-15~50 Celsius Degree
Laser Head
High Speed Galvo Head
Power Supply
AC 110V/220V 50Hz/60Hz 2kVA
Image Formats
Supports Plt, BMP, Dxf, JPG, TIF, Ai, PNG, JPG, Et
Attachment Options
Rotary Chuck, Roller Marking System, CCD Visual-Au
Customized Service
Available (MOQ 1set)
Repeated Accuracy
0.002"
Ipc
Included or Optional
Speed
5,000mm / Sec or 7,000mm /Sec
Cooling Method
Water Cooling
Transport Package
Plywood Case
Specification
75*59*36cm
Trademark
TXT LASER
Origin
China
HS Code
8456100090
Production Capacity
200 Sets Per Year

Packaging & Delivery

Package Size
75.00cm * 59.00cm * 36.00cm
Package Gross Weight
150.000kg

Product Description

The machine adopts originally green laser source and speedy Galvo scanning system. High quality of light beam, long using time, stable equipment performance exempts maintenance. It is speedy, and precious. Marking has non-touched process, permanent effect, humanized operation, and stable running.

The proprietary control software may compatible software output of AutoCAD, CorelDraw, Photoshop, etc. It can realized automatic edition and correction of characters, signs, graphs, images, bar codes, two-dimensional codes, automatically increased serial numbers. It can support various file formats like PLT, PCX, DXP, BMP, JPG, and so on. It may use TIF fonts directly. 24-hour non-stop running makes it meet the demand of massive on-line and off-line industrialized production.


Technical Parameters

  
Machine Model TXT-DB-G5/10/15/20
Laser power 5W 10W 15W 20W (Optional)
Laser Repetition Frequency 20-500kHz
Laser wavelength 532nm
marking Depth (mm) 0.01 ~ 0.5mm(according to the material)
Marking Speed (mm) ≤7000mm/s
Min.Line Width (mm) 0.02 mm
Marking Area(mm) 110*110mm/70mm*70mm (Optional)
Working voltage AC 110 -220V±10%, 50-60Hz

Silicon Wafer Dicing, PCB Stencil Die Board Laser Cutting Machine for PCB Circuit Board FPC IC ChipSilicon Wafer Dicing, PCB Stencil Die Board Laser Cutting Machine for PCB Circuit Board FPC IC Chip
Silicon Wafer Dicing, PCB Stencil Die Board Laser Cutting Machine for PCB Circuit Board FPC IC ChipSilicon Wafer Dicing, PCB Stencil Die Board Laser Cutting Machine for PCB Circuit Board FPC IC ChipSilicon Wafer Dicing, PCB Stencil Die Board Laser Cutting Machine for PCB Circuit Board FPC IC Chip

Green Laser Source And Galvo Head

The brand green laser source to ensure the quality and life time of key parts

The galvo head has good running stability, high positioning accuracy and fast marking speed.

Green laser is perfect for glass marking, thin film etching and surface treatment for most of the metals and non-metal materials, such as removing the oxide layer from the metal surface.

 

Industry Applications

It is mainly used for marking and surface treatment of various glass, liquid crystal screens, textiles, thin ceramics, semiconductor silicon wafers, IC grains, sapphire, polymer films and other materials.

Processing of high-end market, handicrafts, medicine, cosmetics, video and other polymer materials packaging bottle, the mark is very precise and stands wear, better than ink printing and pollution-free; LCD glass QR code marking, glass wares punching, metal surface coating marking, plastic buttons, communications equipment, electronics, gifts, building materials and so on.




Silicon Wafer Dicing, PCB Stencil Die Board Laser Cutting Machine for PCB Circuit Board FPC IC Chip


Silicon Wafer Dicing, PCB Stencil Die Board Laser Cutting Machine for PCB Circuit Board FPC IC ChipSilicon Wafer Dicing, PCB Stencil Die Board Laser Cutting Machine for PCB Circuit Board FPC IC Chip

Silicon Wafer Dicing, PCB Stencil Die Board Laser Cutting Machine for PCB Circuit Board FPC IC Chip
Ezcad
Red Light Pointer Available
Passoword Available
I/O Available
The Galvanometer Correction Available
Graphic Hatch 5 hatch methods
Graphic Edit Lines, Texts, Graphic Edit, Combine, Group, etc
Text Input TrueType Fonts, JSF, DMF, SHX & Customized Fonts
Multi-Layer Edit 256 layer edit
Data Matrix Code Bard code, QR Code, 2D Code, Code39, EAN, PDF417 etc.
Vector File Input PLT, DXF, AI, DST, SVG, GBR, NC, JPC, BOT etc
Image File Input BMP, JPG, JPEG, GIF, TGA, PNG, TIF, TIFF etc
Variable Texts Date, Time, Keyboard Input, Serial No., Excel Date, TXT file.
Communication Mode Serial port communication, Network Communication
Multi Language Chinese, Korean, Japanese, English, French, German,
Silicon Wafer Dicing, PCB Stencil Die Board Laser Cutting Machine for PCB Circuit Board FPC IC ChipSilicon Wafer Dicing, PCB Stencil Die Board Laser Cutting Machine for PCB Circuit Board FPC IC Chip

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